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Mondi to Present Process Liner OLMO Paper® at the UTECH Asia/PU China Fair in Shanghai

Tuesday, August 30, 2011 by Mondi

Mondi Coatings & Consumer Packaging is attending the next edition of the UTECH Asia/PU China fair. The exhibition, held every three years since 1995, will take place from 6 to 8 September in Shanghai (Pudong) at the Shanghai New International Expo Centre (SNIEC).

Mondi looks forward to presenting the wide portfolio of solutions for optimising slabstock production to the Asian market, with special focus on its state-of-the-art process liner OLMO Paper®.

"Mondi is the pioneer of this cost-effective solution which will increase the slabstock production efficiencies of soft foam producers," says Christian Stahlberg, managing director Mondi Örebro. "Olmo Paper is a unique product that combines Kraft paper with a very thin peelable PE film, leading to improved foam characteristics and better processability."

The PE film, left on the bun surface, protects the foam against moisture penetration and against the influences of UV light. It also prevents the paper from flex cracking during production, ensuring less machine stops and cleaning procedures and avoiding longer set-up times. With Olmo Paper, foam producers can increase their productivity by increasing the production speed, improving the quality outcome and considerably lowering the waste produced. An additional advantage is the recyclability of the Kraft paper.

Stahlberg emphasises the importance of the Shanghai fair: "Given the special dynamics of the Asian market, the UTECH Asia is the ideal platform to meet Asian entrepreneurs for sharing business experiences and discussing opportunities."