India’s largest multinational flexible packaging materials and solution company Uflex is attending the forthcoming PACK EXPO International event.
The US tradeshow takes place on 6-9 November at McCormick Place in Chigago, Illinois, US. The event will host more than 45,000 from around 40 vertical markets.
Uflex will be at Booth N-4749.
Approximately 7,000 international purchasers are expected to be in attendance from more than 130 countries.
More than 2,100+ companies will be exhibiting over the three days, covering around 1.2 million square feet.