Novellus Systems said it has developed a new technology for the emerging through-silicon-via (TSV) semiconductor packaging market.
California-based Novellus said the copper barrier-seed physical vapor deposition (PVD) process uses the Hollow Cathode Magnetron (HCM) technology to produce copper seed films.
These films are four times thinner than the conventional PVD seed approaches used for TSV applications, which enable three-dimensional packaging, where multiple chips are stacked on top of each other into one space-saving 3-D module.
The new technology also delivers a smaller packaging footprint, which is important for the mobile consumer electronics market, the company said.
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