A new study has found a modifier that can raise bioplastic's heat-deflection temperature by at least 50°F, helping to expand the sphere of packaging applications.
Researchers at Agricultural Research Service (ARS), US, say they have devised a temperature deflection modifying mechanism that boosts heat resistance properties of bioplastic polylactic acid (PLA).
The modifier is more than 90% corn based and fully biodegradable, the team said.
The modifier will help the PLA, which could be used for food and beverage containers that are based on hot-filling technology, the team said.
Normal corn-based plastics have a lower heat tolerance than petroleum-based plastics, which exclude it from being used for packaging applications, according to foodproductiondaily.com.
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