Bemis and Thin Film to develop flexible packaging platform

10 July 2012 (Last Updated July 10th, 2012 18:30)

Flexible packaging and pressure-sensitive materials provider Bemis has selected Thin Film Electronics to develop a flexible sensing platform for the packaging market.

Flexible packaging and pressure-sensitive materials provider Bemis has selected Thin Film Electronics (Thinfilm) to develop a flexible sensing platform for the packaging market.

The intelligent packaging platform, which is expected to be commercially available in 2014, can collect and wirelessly communicate sensor information worldwide for use by food and consumer products, and healthcare companies.

As part of the agreement signed with Bemis, Thinfilm will extend its previous work on the development of an integrated time-temperature sensor for use in monitoring perishable goods and pharmaceuticals.

Thinfilm said it will create a customisable sensor platform, that will be tailored for its customers' individual requirements by Bemis at a later stage.

Bemis president and chief executive officer Henry Theisen said its agreement represents an investment in a technology that could finally make printed electronics a component of every package the company manufactures.

"Intelligent packaging is an emerging technology with many potential intersections with Bemis' flexible packaging and pressure-sensitive materials business segments," Theisen added.

According to PCI Films Consulting, the flexible packaging market for North America alone is expected to be $18.3bn.

Bemis' packaging is used for a broad range of products from meat and cheese to medical devices and personal care items.

Norway-based Thin Film creates printed system products including memory, sensing, display and wireless communication.