Henkel has launched a new hotmelt adhesive for the food packaging industry to promote sustainability in customer operations.
The new Technomelt Supra 100 Cool has an application temperature of 100°C. Production trials undertaken by consumer goods manufacturers in Europe have found that this low temperature reduces energy costs by up to 50% compared to conventional hotmelts.
The adhesive is suitable for various food industry applications, including case sealing, carton closing and tray erection. It can also be used in both warm-filling and deep-freeze applications.
Technomelt Supra 100 Cool cuts down adhesive consumption for carton sealing by up to 25% compared to Coolmelt Ultra 90, another adhesive available from the German company.
The hotmelt also increases the lifetime of machines. It reduces the maintenance input involved in removing cracking residues as well as the amount of wear and tear to which machine components and applicators are subjected to.
The Technomelt Supra 100 Cool is claimed to be the lowest application temperature hotmelt available in the marketplace.
Image: Henkel’s new Technomelt Supra 100 Cool adhesive is suitable for food packaging industry. Photo: courtesy of Henkel AG & Co. KGaA.