Nampak installs W&H coextrusion line at Pinetown site in South Africa

13 May 2013 (Last Updated May 13th, 2013 18:30)

Nampak Flexible has installed a new seven-layer coextrusion line procured from German engineering company Windmöller & Hölscher (W&H), at its site in Pinetown, KwaZulu-Natal, South Africa.

Nampak Flexible has installed a new seven-layer coextrusion line procured from German engineering company Windmöller & Hölscher (W&H) at its site in Pinetown, KwaZulu-Natal.

The site, which already houses various single and three-layer blown film lines, produces food and other flexible films.

Nampak Flexible managing director Clinton Farndell said the company selected the coextrusion line, as it planned to increase production capacity and address market demand for high-barrier film and laminates, specifically in the sectors such as meat, dairy and food.

"We couldn't achieve the latter on our existing machine, so the new line has given us the freedom to improve our product offering and deliver world-class multilayer and laminated formulations," Farndell said.

According to the South African packaging company Nampak, the film line, which stands 18m tall, features seven-layer die designed to handle extreme layer ratios.

The line ensures steady control of the melt temperature, cuts down film gauge tolerances and increases film quality at better output rates.

Other core elements include ravimetric throughput control, internal bubble cooling, profile measurement and control, multinip oscillating haul-off, non-stick coated turning bars as well as remote motorised adjustment.

W&H's precision engineering will allow the packaging company to manufacture multilayer films with fully-recyclable properties that perform well on the automated filling and sealing lines of the customers.

Nampak Flexible has also invested in the new micro-laser perforating system from Rofin Baasel in the UK, which has been installed inline as part of the slitting process.

The system performs at a maximum perforating speed of 1 000 000 holes/sec, with a hole diameter from 50µm to 300µm.