Esko has introduced a new release of ArtiosCAD, version 12, offering a shift in packaging design from 2D to 3D.

Available in two versions, the standard version and ArtiosCAD 12 Enterprise, ArtiosCAD provides tools for 3D design, editing, rendering and visualisation, and assures that the viability of a package is discovered further upstream in the supply chain.

ArtiosCAD, the structural packaging design editor in Esko’s software suite, also provides new tools for packaging design and process integration, assisting users in gaining productivity and increasing efficiency.

ArtiosCAD 12 has integrated the latest native 3D file import libraries from Esko’s technology partner Spatial, offering a speed improvement of over 50%, which allows designers to spend less time waiting to import 3D models.

According to Belgium-based Esko, the technology also helps to assemble multi-part designs and displays with a number of new time-savings features; for instance, users can fill a carton, case or tray with the product to be packaged with a single mouse click.

ArtiosCAD 12 can show the flap priorities of panels to communicate printable areas for graphic design accurately, and for re-board and multi-wall displays and designs, it can add edge bands for finished edge calculations and visualisation, along with building reverse v-notches with partial cuts for accurate conversion of the materials.

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By GlobalData

A set of editing tools that enriches an ArtiosCAD file with detailed panel information such as ‘copy free’, along with placeholders for barcodes, nutrition facts and other pre-defined artwork, is the concept of intelligent dielines in ArtiosCAD 12.

The intelligent dielines features can be used by brand owners to communicate brand guidelines within their technical drawings, helping to improve communications between structural and graphic designers.

ArtiosCAD 12 supports bi-directional communication between both CAPE and TOPS palletisation software packages, doing away with the need for structural designers to re-enter data into both systems.