US-based provider of complete packaging line solutions Harpak-ULMA has partnered with Rockwell Automation to develop smart, connected packaging solutions.
The company has entered this partnership after joining the Rockwell Automation PartnerNetwork programme as an OEM Machine Builder.
As part of the deal, Harpak will offer its ULMA Thermoformer lines with Rockwell’s Integrated Architecture production control and information system.
They can also use IoT and augmented reality platforms from smart manufacturing software firm PTC.
Harpak has also demonstrated PTC’s augmented reality application, which uses tablets, smartphones, or glasses to assist employees’ maintenance or production activities through 3D work instructions.
Harpak-ULMA CEO Kevin Roach said: “IoT, AI, machine learning, big data, predictive maintenance, and augmented reality are just a few of the ways that connected machines promise to improve packaging operations and reduce total cost of ownership, but realising those benefits will require nothing short of rethinking packaging automation.”
The partnership has also developed advanced thermoforming machine capabilities to assist packaging firms in managing overall equipment effectiveness (OEE) and other crucial key performance indicators (KPIs) across lines featuring varied equipment.
Harpak offers packaging line solutions and connected packaging systems for food, medical, bakery, and industrial products.
The company distributes G Mondini tray sealers, ULMA primary packaging equipment, RAMA secondary packaging machinery and DIGI weigh/price/labelling equipment.