US-based industrial gases company Air Products is set to launch a fluxless soldering technology that uses electron attachment (EA) technology for wafer level packaging applications.

The proposed launch is expected to take place at the IPC APEX Expo in San Diego, California, US, later this month.

Go deeper with GlobalData

Premium Insights

The gold standard of business intelligence.

Find out more

Related Company Profiles

View all

Using activated hydrogen at ambient pressure, the EA technology removes metal oxides from electroplated solder bumps on semiconductor wafers.

The technology also helps to obtain the relevant shape and size for interconnection onto a package or substrate by allowing reflow of the bumps, as well as offers an enhanced bump reflow quality as a result of flux induced solder voids and wafer contaminations, which naturally get eliminated.

“Using activated hydrogen at ambient pressure, the EA technology removes metal oxides from electroplated solder bumps on semiconductor wafers.”

Air Products noted that the technology improves productivity from in-line process capability, which decreases or eliminates post wafer cleaning and furnace downtime for cleaning.

End users are expected to benefit from EA’s low cost of ownership due to its ability to reduce or eliminate expenditure related to cleaning equipment, cleaning solution, labour work and flux.

How well do you really know your competitors?

Access the most comprehensive Company Profiles on the market, powered by GlobalData. Save hours of research. Gain competitive edge.

Company Profile – free sample

Thank you!

Your download email will arrive shortly

Not ready to buy yet? Download a free sample

We are confident about the unique quality of our Company Profiles. However, we want you to make the most beneficial decision for your business, so we offer a free sample that you can download by submitting the below form

By GlobalData
Visit our Privacy Policy for more information about our services, how we may use, process and share your personal data, including information of your rights in respect of your personal data and how you can unsubscribe from future marketing communications. Our services are intended for corporate subscribers and you warrant that the email address submitted is your corporate email address.

Environmental  benefits of the technology also include elimination of organic vapours, hazard residues and CO2 emissions.

Air Products has formed a partnership with Sikama International to offer an electron attachment fluxless reflow system (EAUP1200).

The partners designed the furnace so that it removes metal oxides from solder bumps on UBM wafers and solder caps from copper pillar wafers, with support from the EA technology.