All articles by Claire Jenns

With experience in arts and culture journalism, Claire brings a fresh perspective to Hotel Management Network, Retail Insight Network and Packaging Gateway. She is passionate about sustainability, workers' rights and geopolitics.

Claire Jenns

Realising marketing objectives through packaging design

At London Packaging Week 2023, Zenpack founder and creative director Leo Chao discussed packaging’s central role in marketing.

EPR scheme: DEFRA urges industry cooperation, reveals levied materials

At London Packaging Week, The Department for Environment, Food and Rural Affairs encouraged the industry to provide its thoughts on the Extended Producer Responsibility (EPR) scheme.

Xampla launches new consumer brand for plant-based materials

Cambridge-based Xampla has launched consumer brand, Morro, as part of its mission to rid the world of the most polluting single-use plastics.

The great recycling debate: are businesses or consumers responsible?

A heated debate at London Packaging Week 2023 saw industry panellists clash over the roles of consumers and businesses in recycling efforts.

DS Smith taps Amazon Web Services as cloud provider

DS Smith will use AWS’s global infrastructure, analytics, Internet of Things, artificial intelligence and machine learning technologies.

RRD reveals plan to reduce carbon emissions

Packaging company RR Donnelley & Sons has announced its commitment to reduce its carbon emissions by 25% over the next ten years.

Legal judgment made on Hindusthan National Glass insolvency

The National Company Law Appellate Tribunal, Delhi has delivered its decision for the contentious insolvency case of Hindusthan National Glass.

British Sugar leverages Sidel’s end-of-line solution

Sidel has been appointed to install a flexible end-of-line turnkey solution for British Sugar to meet market requirements.

Intel unveils glass substrates for advanced packaging

Glass substrates possess mechanical, physical, and optical properties that allow for more transistors to be connected in a package.

Schott launches microelectronic packaging for aerospace

Made of aluminium, the new packaging is designed to protect against the harsh conditions of aviation and space.