Avery Dennison. has developed a temperature-sensing RFID device with a chip containing a temperature sensor and an antenna. The device includes a structure to shield the sensor from environmental factors and enhance thermal coupling between the sensor and the article it is attached to. GlobalData’s report on Avery Dennison gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Avery Dennison, Pressure Sensitive Adhesive Tape was a key innovation area identified from patents. Avery Dennison's grant share as of January 2024 was 59%. Grant share is based on the ratio of number of grants to total number of patents.
Temperature-sensing rfid device with enhanced thermal coupling
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The patent application (Publication Number: US20240020508A1) describes a temperature-sensing RFID device designed to monitor the temperature of an article it is attached to. The device includes an RFID chip with a temperature sensor, an antenna for receiving energy and producing a signal, and a thermally conductive or absorbent structure positioned between the RFID chip and the article. This structure enhances thermal coupling between the temperature sensor and the article, ensuring accurate temperature monitoring.
Furthermore, the device's antenna design plays a crucial role in its functionality. The antenna comprises conductors positioned on opposite sides of the RFID chip, connected by a strap and a conductive loop. This loop, along with other components of the antenna, is in direct contact with the RFID chip and the article, facilitating efficient temperature tracking. Additionally, the thermally conductive structure may include features such as an infrared-absorbing color, adhesive with high thermal conductivity particles, and a specific thermal mass to optimize temperature monitoring capabilities. Overall, the innovative design of this temperature-sensing RFID device aims to provide accurate and reliable temperature tracking for various applications.
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