Receive our newsletter – data, insights and analysis delivered to you
  1. News
November 2, 2018updated 05 Nov 2018 3:04pm

Air Products unveils Aroma MAP system for food packaging

US-based industrial gases company Air Products has unveiled its Freshline Aroma modified atmosphere packaging (MAP) system in a move to assist food manufacturers in preserving product aromas.

US-based industrial gases company Air Products has unveiled its Freshline Aroma modified atmosphere packaging (MAP) system in a move to assist food manufacturers in preserving product aromas.

Designed for packaged foods, Aroma MAP preserves natural aromas and flavours such as essential oils by vaporising them into the packaging.

The system can be incorporated into a manufacturer’s existing packaging line. It works by injecting a precise and repeatable amount of aroma or essential oils into the gas flow followed by transferring the mixture into the packaging machine.

Air Products industrial cryogenic and food expert Neil Hansford said: “The packaged food market is growing, along with MAP. Using natural solutions to tailor and enhance the customer experience in this space offers manufacturers real opportunities, you could say it’s a win-win for all concerned.”

“Using natural solutions to tailor and enhance the customer experience in this space offers manufacturers real opportunities.”

In addition to enhancing the customers’ sensory experience, the new technology will allow food manufacturers to tackle food waste and reduce unnecessary costs associated with product returns.

According to the company, Aroma MAP is suitable for a range of food products such as processed meat, dried foods, and bakery items. It is claimed to comply with all relevant legislation and best practices.

Content from our partners
GMP: The food sector’s golden rules (and how they will evolve)
Food fraud in the supply chain (and how to fix it)
Cutting-edge innovation in fish packaging

In February, Air Products unveiled a fluxless soldering technology, using electron attachment (EA) technology for wafer-level packaging applications.

Using activated hydrogen at ambient pressure, the EA technology removes metal oxides from electroplated solder bumps on semiconductor wafers.

Related Companies

NEWSLETTER Sign up Tick the boxes of the newsletters you would like to receive. The top stories of the day delivered to you every weekday. A weekly roundup of the latest news and analysis, sent every Friday. The packaging industry's most comprehensive news and information delivered every month.
I consent to GlobalData UK Limited collecting my details provided via this form in accordance with the Privacy Policy
SUBSCRIBED

THANK YOU