Altera and TSMC develop industry-first UBM-free WLCSP packaging technology

6 April 2015 (Last Updated April 6th, 2015 18:30)

US-based Altera Corporation and TSMC have collaborated on what they claim as the industry-first, UBM-free (under-bump metallisation) wafer-level chip scale package (WLCSP) technology.

US-based Altera Corporation and TSMC have collaborated on what they claim as the industry-first, UBM-free (under-bump metallisation) wafer-level chip scale package (WLCSP) technology.

The new technology has been developed to offer enhanced quality, reliability and integration for Altera's MAX 10 FPGA products, resulting in an extremely thin package height of less than 0.5mm suitable for applications where there is shortage of space such as sensor applications, small form-factor industrial equipment and portable electronics.

"Altera's work with TSMC has produced a very advanced and integrated packaging solution for MAX 10 devices."

Companies say the technology also offers 200% improvement in board-level reliability compared with standard WLCSP, and result in improved package I/O count along with creation of a large die size envelope.

Altera vice-president of worldwide operations and engineering Bill Mazotti said: "Altera's work with TSMC has produced a very advanced and integrated packaging solution for MAX 10 devices.

"Leveraging this innovative technology to improve integration, quality and reliability makes MAX 10 FPGA products more versatile and useful for our customers."

Commenting on the development, TSMC North America executive vice-president David Keller said: "Our decades-long technology collaboration with Altera continues to produce dramatic results such as this UBM-free packaging innovation.

"Continuous improvement in all areas from design, to manufacturing, to packaging is our shared goal and commitment, and we look forward to many more years of working closely with Altera."

Altera is currently testing MAX 10 FPGA products with the new WLCSP packaging.