US-based Altera Corporation and TSMC have collaborated on what they claim as the industry-first, UBM-free (under-bump metallisation) wafer-level chip scale package (WLCSP) technology.

The new technology has been developed to offer enhanced quality, reliability and integration for Altera’s MAX 10 FPGA products, resulting in an extremely thin package height of less than 0.5mm suitable for applications where there is shortage of space such as sensor applications, small form-factor industrial equipment and portable electronics.

Go deeper with GlobalData

Premium Insights

The gold standard of business intelligence.

Find out more

Related Company Profiles

View all
"Altera’s work with TSMC has produced a very advanced and integrated packaging solution for MAX 10 devices."

Companies say the technology also offers 200% improvement in board-level reliability compared with standard WLCSP, and result in improved package I/O count along with creation of a large die size envelope.

Altera vice-president of worldwide operations and engineering Bill Mazotti said: "Altera’s work with TSMC has produced a very advanced and integrated packaging solution for MAX 10 devices.

"Leveraging this innovative technology to improve integration, quality and reliability makes MAX 10 FPGA products more versatile and useful for our customers."

See Also:

Commenting on the development, TSMC North America executive vice-president David Keller said: "Our decades-long technology collaboration with Altera continues to produce dramatic results such as this UBM-free packaging innovation.

How well do you really know your competitors?

Access the most comprehensive Company Profiles on the market, powered by GlobalData. Save hours of research. Gain competitive edge.

Company Profile – free sample

Thank you!

Your download email will arrive shortly

Not ready to buy yet? Download a free sample

We are confident about the unique quality of our Company Profiles. However, we want you to make the most beneficial decision for your business, so we offer a free sample that you can download by submitting the below form

By GlobalData
Visit our Privacy Policy for more information about our services, how we may use, process and share your personal data, including information of your rights in respect of your personal data and how you can unsubscribe from future marketing communications. Our services are intended for corporate subscribers and you warrant that the email address submitted is your corporate email address.

"Continuous improvement in all areas from design, to manufacturing, to packaging is our shared goal and commitment, and we look forward to many more years of working closely with Altera."

Altera is currently testing MAX 10 FPGA products with the new WLCSP packaging.