Fraunhofer Institute for Process Engineering and Packaging IVV (Fraunhofer IVV) has developed an ultra-barrier film using atomic layer deposition.
The films, which can be used to pack organic electronics, will be presented at the International LOPEC Fair in Munich that will be from 6-7 April.
Go deeper with GlobalData
A new plant is under construction at the institute to manufacture coated films using an atomic layer deposition mechanism. This will allow the institute to lower the permeability of films and deliver new film products to the industry.
The atomic layer deposition (ALD) mechanism helps to reduce the permeability to water vapour and oxygen. The ALD method is suitable for roll-to-roll processes and bolsters high production efficiency.
Its processing speed is almost equivalent to vacuum processes used for developing the highest barrier films. This new mechanism will be used for publicly funded R&D projects to offer customised solutions in the area of process and material development.
See Also:
Fraunhofer IVV claimed the ALD technology and its expertise in the areas of high barrier films will improve the quality of barrier films required for OLED encapsulation.
How well do you really know your competitors?
Access the most comprehensive Company Profiles on the market, powered by GlobalData. Save hours of research. Gain competitive edge.
Thank you!
Your download email will arrive shortly
Not ready to buy yet? Download a free sample
We are confident about the unique quality of our Company Profiles. However, we want you to make the most beneficial decision for your business, so we offer a free sample that you can download by submitting the below form
By GlobalDataImage: High-barrier films developed at the Fraunhofer IVV. Photo: courtesy of Fraunhofer IVV.
