Japanese manufacturer of ceramic substrates / packages Kyocera Corporation has commenced construction of its third manufacturing facility at its Kyoto Ayabe complex in Ayabe City, Kyoto Prefecture, Japan.
The latest development will expand the company’s production of organic packages for microelectronic devices.
Kyocera will produce miniaturised, low-profile packages to house devices used in smartphones, tablet PCs and related mobile communications equipment.
The 13,143m² Kyoto Ayabe complex was previously operated by Kyocera Circuit Solutions.
Construction is expected to be completed by December, and the facility is expected to open in April 2017.
According to Kyocera, its microelectronic packaging technology enables improved functionality and integration and slimmer designs in mobile communications equipment.
Kyocera’s market is also expected to grow as consumer devices incorporate multiple internal modules for camera, wireless, power amplifier and control functions.
With the expansion of the IoT (Internet of Things), the company expects to generate new applications for Kyocera microelectronic packaging technology, such as wireless chips and sensor chips.
Earlier this year, Kyocera Circuit Solutions merged with Kyocera Corporation in a bid to enhance the development of new products and markets.
In 2014, the company inaugurated its second facility at Kyoto Ayabe.