Electronic components supplier KEMET is using KONNEKT high-density packaging technology to expand the range of KC-LINK capacitors.

The combination will boost the company’s power conversion solutions and help fulfil the demand for applications such as wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters, and wireless charging applications.

KONNEKT technology offers a low-loss, low-inductance package. It uses an innovative Transient Liquid Phase Sintering (TLPS) material.

When KC-LINK’s C0G Base Metal Electrode (BME) dielectric system is integrated with KONNEKT’s technology, it results in the formation of a surface mount multi-chip solution suitable for high-density packaging.

Moreover, KC-LINK capacitors with KONNEKT have high mechanical robustness that eliminate the need them to be mounted using lead frames.

The mounting orientation of the KONNEKT capacitors will be in the Tape and Reel pockets. This positioning allows pick and place machines to keep the capacitors in the correct orientation.

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KEMET vice-president and technical fellow Dr John Bultitude said: “The low ESR of KC-LINK capacitors results in best-in-class ripple current capability.

“Combined with KONNEKT technology, this solution delivers thermal stability and mechanical robustness through increased efficiency by combining multiple capacitors into a single high density, ultra-low loss package.”

KEMET’s KC-LINK range with KONNEKT technology is now available with KEMET distributors.

Headquartered in Fort Lauderdale, Florida, KEMET provides a range of capacitor technologies.