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August 24, 2020

Monozukuri presents integrated IC/Package co-design EDA tool

European EDA company Monozukuri is presenting the first-commercially available fully integrated IC/Package co-design EDA platform.

European EDA (electronic design automation) company Monozukuri is presenting the first-commercially available fully integrated IC/Package co-design EDA platform.

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Named as Genio, the “environment-agnostic end-to-end” solution is being offered to enable 2D/2.5D/3D system designs.

The platform integration will help develop a complete optimisation of co-design and I/O of complicated multi-chip designs.

According to Monozukuri, Hiper is the underlying technology of the Genio product suite. It was developed under the Horizon 2020 European project to redefine the co-design of heterogeneous microelectronic systems.

Monozukuri founder and CEO Anna Fontanelli said: “Genio is not a promise or partial solution.  It a breakthrough, ground-up tool that is ready for implementation today.

“Genio’s holistic design environment includes complete floor planning, I/O planning and end-to-end interconnect planning combined with cross-hierarchical pathfinding optimisation.”

Genio features full “cross-hierarchical, 3D-aware, design methodologies” and duet graphic user interface.

These ensure complete system level optimisation with the integration of IC and advanced packaging design. It also shortens the design cycles, accelerates time-to-manufacturing and enhances results.

The company has also started taking orders for Genio.

Headquartered in Rome, Monozukuri is a privately held company founded in 2014 and supported by Italian private and institutional investors.

The European Commission granted funding to the company two times within the Hrizon2020-SME Instrument, Phase I and II.

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Free Whitepaper
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Making the Packaging System Fit the Circular Economy

For the packaging industry to achieve a sustainable future, it needs to dramatically increase circularity and the reuse of materials. While shifting from a linear economy to a circular model will take time, there are already actions that brands, manufacturers, and converters can already take to help make a difference. This document by Siegwerk – a global leader in inks and coatings for packaging – delves into solving the plastic paradox, looks at the relevance of bioplastics, and sets out ways to not only achieve circularity in packaging but also make it economically viable. Furthermore, the document goes into detail on how printing inks and coatings are vital for enabling circularity in packaging. Ultimately, the packaging system needs to be reconfigured for a circular future. And consumers are expecting the packaging industry to play its part in progress. To take the first step towards circularity, download this document.
by Siegwerk
Enter your details here to receive your free Whitepaper.

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