Microelectronic packaging and assembly solutions provider Quik-Pak has acquired US-based wafer-preparation services company QBBS for an undisclosed amount.

The acquisition of QBBS’s automated backgrinding technology is expected to enhance Quik-Pak’s volume capacity to process customer wafers.

With the deal finalised earlier this month, Quik-Pak is expected to incorporate the QBBS’s technology into its wafer-preparation line early next year.

Quik-Pak CEO Ken Molitor said: “This acquisition is highly complementary to our existing wafer thinning, dicing and dye inspection business.

“We have had a relationship with QBBS for many years, tapping them to accommodate customers who needed volume backgrinding services. Being able to deliver this capability directly will greatly enhance our customer relationships and allow us to broaden our market reach.”

QBBS technology can conduct automated, volume backgrinding of a cassette with 25 whole wafers, from four to eight inches in diameter and partial wafers, as well as 12-in quartered wafers.

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Quik-Pak’s current backgrinding services will continue to be offered. It comprises of thinning wafers from up to 300mm in diameter to as low as 75 microns and 200mm wafers to 25 microns.

QBBS founder and CEO Carmen Perry said: “Selling the business to Quik-Pak was the right decision at the right time. We sought an appropriate exit strategy, and Quik-Pak is on a strong growth path.

“Our technology and customer base are an excellent fit, and I am pleased that we were able to strike a mutually beneficial agreement with our long-time partner and proven industry leader.”