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October 7, 2019

Samsung Electronics develops 3D chip packaging technology

South Korean multinational electronics company Samsung Electronics has developed a 12-layer 3D Through Silicon Via (TSV) chip packaging technology.

South Korean multinational electronics company Samsung Electronics has developed a 12-layer 3D Through Silicon Via (TSV) chip packaging technology.

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The packaging innovation will involve vertically interconnecting 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes.

The new technology will offer identical capability with the same thickness (720µm) as the current eight-layer high-bandwidth memory-2 (HBM2) products.

The 3D-TSV technology will enable the mass production of high-performance chips.

Samsung Electronics test and system package executive vice-president Hong-Joo Baek said: “Packaging technology that secures all of the intricacies of ultra-performance memory is becoming tremendously important, with the wide variety of new-age applications such as artificial intelligence (AI) and high-power computing (HPC).

“As Moore’s law scaling reaches its limit, the role of 3D-TSV technology is expected to become even more critical. We want to be at the forefront of this state-of-the-art chip packaging technology.”

The 3D packaging technology will allow customers to release high-performance products with increased capacity, using the existing system configuration designs.

The new system has significantly improved, comparing to the existing wire-bonding technology since it reduces data transmission time between chips.

This increases speed and reduces power consumption.

Samsung noted that the 12-layer 3D-TSV technology will offer increased DRAM performance for high-speed and data-intensive applications.

The technology will enable the company to mass-produce 24GB high-bandwidth memory.

The company expects to meet the growing demand for high-capacity HBM solutions.

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For the packaging industry to achieve a sustainable future, it needs to dramatically increase circularity and the reuse of materials. While shifting from a linear economy to a circular model will take time, there are already actions that brands, manufacturers, and converters can already take to help make a difference. This document by Siegwerk – a global leader in inks and coatings for packaging – delves into solving the plastic paradox, looks at the relevance of bioplastics, and sets out ways to not only achieve circularity in packaging but also make it economically viable. Furthermore, the document goes into detail on how printing inks and coatings are vital for enabling circularity in packaging. Ultimately, the packaging system needs to be reconfigured for a circular future. And consumers are expecting the packaging industry to play its part in progress. To take the first step towards circularity, download this document.
by Siegwerk
Enter your details here to receive your free Whitepaper.

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