Siemens’ Mentor introduces new high-density advanced packaging flow solution

5 June 2017 (Last Updated June 5th, 2017 18:30)

Siemens business Mentor has introduced a new productive solution, the Xpedition high-density advanced packaging (HDAP) flow, for advanced integrated circuit (IC) package design.

Siemens business Mentor has introduced a new productive solution, the Xpedition high-density advanced packaging (HDAP) flow, for advanced integrated circuit (IC) package design.

The solution leverages Mentor Xpedition, HyperLynx and Calibre technologies to deliver faster results compared to existing HDAP methodologies.

It also provides early, rapid and accurate ‘what-if’ prototype evaluations, and allows optimisation of HDAP designs before detailed implementation.

Mentor’s new HDAP solution consists of multi-substrate integration prototyping with detailed physical implementation with foundry / on-site assessment and training (OSAT) level verification and signoff.

"Package designers can simulate SI/PI 3D models using the HyperLynx FAST 3D field solver for extraction and analysis."

The new HDAP flow is equipped with the Xpedition Substrate Integrator tool which explores and integrates heterogeneous ICs with interposers, packages, and PCBs to allow predictable assembly prototyping of complete cross-domain substrate systems.

It also features Xpedition Package Designer tool that manages the physical implementation of the package.

The Xpedition HDAP flow is integrated with two Mentor HyperLynx technologies for 3D signal integrity (SI) and power integrity (PI), as well as in-process design rule checking (DRC).

Package designers can simulate SI/PI 3D models using the HyperLynx FAST 3D field solver for extraction and analysis.

The HyperLynx DRC tool detects and resolves about 80-90% of substrate-level DRC errors before final tape-out and sign-off verification.