Technology firm Tessera Technologies will be acquiring US-based Ziptronix for $39m in an all-cash transaction.

Tessera will be able to expand its existing advanced packaging capabilities by the addition of a low-temperature, wafer-bonding technology platform that will help in speeding up its delivery of 2.5D and 3D-IC solutions to customers from the semiconductor industry.

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Founded in 2000 as a venture-backed spinoff of RTI International, Ziptronix specialises in low-temperature direct bonding technology for 3D integration.

"This is a great alignment of companies that can address rapidly expanding 2.5D and 3D-IC markets."

Tessera CEO Tom Lacey said: "With the escalating cost for each node of semiconductor lithography, it remains very clear to us that our R&D spend on semiconductor packaging will only become more important and valuable to our customers.

"Ziptronix has commercially licensed the ZiBond and DBI technologies and they stack up very well alongside our extensive portfolio of 2.5D and 3D intellectual property.

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"I’m confident that aligning our respective capabilities with our development expertise will help create a multi-hundred million dollar revenue opportunity for Tessera over the next decade as the industry continues to shift toward 3D-IC architectures."

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Earlier this month, Tessera had reported total revenues for three months ending 30 June to be around $64.2m. The company had $21.4m in cash and cash equivalents and $410.5m in short-term investments, reported the Triangle Business Journal.

Ziptronix CEO and president Dan Donabedian said: "We’ve taken our technology from concept to commercialisation in the backside illuminated image sensor and RF markets.

"Joining the Tessera family of companies combines our efforts with a proven leader in technology development and licensing in the semiconductor industry. This is a great alignment of companies that can address rapidly expanding 2.5D and 3D-IC markets."