US-based semiconductor packaging provider Amkor Technology has opened a new microelectromechanical systems (MEMS) and sensor packaging line at its facility in Shanghai, China.
The new MEMS and sensor line, which was constructed with an investment of around $60m, uses Amkor’s standard strip-based processes.
Based on Amkor’s MEMS packaging line in the Philippines, the new line in China seeks to meet the increased demand for sensors from the smartphone and automotive markets worldwide.
Since 2011, Amkor’s Philippines MEMS packaging line has produced more than 2.1 billion MEMS and sensors units.
Amkor mainstream products business unit corporate vice-president John Donaghey said: "Because the package influences device performance, MEMS and sensor development requires close collaboration between device technologists and packaging engineers.
"Our Shanghai expansion allows us to better serve customers in Greater China and internationally."
According to Yole Développement, the increase in sensor content of smartphones, internet of things (IoT) devices, and smart automobiles have encouraged unit growth in the MEMS market to a 13% compound annual growth rate through 2021.
Last July, Amkor announced plans to expand its China-based assembly and test factory to offer around 60,000m² of cleanroom space.