US-based Rudolph Technologies has unveiled two new inspection and metrology solutions to help manufacture an advanced semiconductor.

The newly launched Firefly system can be used for high-resolution inspection in front and back-end applications, while the new Dragonfly system can be applied for 2D inspection in advanced packaging methods.

Both the new systems have been developed to help device manufactures in detecting faulty type, size, and achieving maximum throughput.

"The Firefly and Dragonfly systems offer our customers the most comprehensive and flexible inspection platforms available on the market today."

Rudolph Technologies CEO Mike Plisinski said: “Automotive, mobility and the internet of things (IoT) markets are fuelling demand for low-cost, high-performance devices packaged in complex multichip modules.

“This dynamic has driven creative packaging approaches that mix and match various technologies and require advanced inspection and metrology for shrinking redistribution lines (RDL) and other interconnect features, as well as inspection for smaller defects and organic contaminants.

“The Firefly and Dragonfly systems offer our customers the most comprehensive and flexible inspection platforms available on the market today and reflect an emphasis on increasing our R&D cadence, while maintaining high standards of quality and usability.”

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The Firefly inspection and metrology system has been designed to detect flaws smaller than 1μm in various applications, such as fan-out wafer level packaging (FOWLP), CMOS image sensors, microelectromechanical systems (MEMS) and radio frequency (RF) sensors.

Configured for round or rectangular substrates, the Firefly system is equipped with Rudolph’s newly launched patented Clearfind technology, which uses fluorescing organic materials to detect defects.

Rudolph will start shipping the system to Asian customers from September.

Offering a 2D inspection sensitivity of 2μm, the new Dragonfly inspection and metrology system can be used for large die, multi-chip advanced packaging applications.

The system enables in-process inspection and metrology for wafer reconstitution, as well as detection, imaging, and defect analysis on various devices and packages.

The Dragonfly 2D systems are expected to be delivered to an Asian foundry in late 2016.