US-based Rudolph Technologies has won an order worth more than $11m to provide an integrated packaging inspection solution to an undisclosed open-source-appropriate technology (OSAT) provider in Asia.
Known as fan-out wafer level packaging (FOWLP), the solution will include multiple process control inspection systems and a yield management software suite
It offer a variety of functions, including whole wafer inspection, 3D bump metrology and post-saw die inspection.
Deliveries of the new systems were scheduled to start from the second quarter of 2016, while the majority of the order will be shipped later in the year.
Rudolph Technologies process control group business unit vice-president and general manager Mike Goodrich said: "We are pleased with this order and the confirmation of Rudolph Technologies’ fan-out wafer level packaging (FOWLP) solution portfolio.
"Key factors of this win were the systems’ unique FOWLP process control capabilities, including superior defect capture and identification rate, combination 2D+3D metrology and flexible wafer automation solutions.
"All systems will be equipped with Rudolph’s Discover Yield Management Software and TrueADC Classification software that enhances the user’s process analysis capability, enabling our customers to make targeted data-driven decisions increasing the total productivity of the overall fab."
Rudolph noted that its NSX Series inspection system product family provides automated macro defect inspection and metrology for advanced packaging manufacturing.
The NSX 330 Series is designed to provide flexible handling and sensor options when combined with advanced process management software capabilities.
Rudolph has also designed Discover YMS, an in-line defect, metrology and data management system that will improve the company’s process analysis capability in real-time and post inspection analysis.
Additionally, the company has developed TrueADC software, which is designed to automatically categorise defects detected by the NSX systems.