The global packaging industry experienced a 28% decline in the number of robotics-related patent applications in Q3 2023 compared with the previous quarter. The total number of robotics-related grants dropped by 55% in Q3 2023, according to GlobalData’s Patent Analytics. GlobalData’s databook Packaging: Patents Trends Q3 2023 offers comprehensive insights into patenting trends, major players’ strategies, and geographical focus in the sector over the last three years. Buy the databook here.
Notably, the number of robotics-related patent applications in the packaging industry was 82 in Q3 2023, versus 114 in the prior quarter.
The top five companies accounted for 20% of patenting activity
Analysis of patenting activity by companies shows that Nippon Shuppan Hanbai filed the most robotics patents within the packaging industry in Q3 2023. The company filed 5 robotics-related patents in the quarter. It was followed by Weber Maschinenbau GmbH Breidenbach with 3 robotics patent filings, Grifols (3 filings), and Toyo Seikan Group (3 filings) in Q3 2023.
Patenting activity was driven by the US with a 35% share of total patent filings
The largest share of robotics related patent filings in the packaging industry in Q3 2023 was in the US with 35%, followed by China (13%) and South Korea (6%). The share represented by the US was 16% higher than the 19% share it accounted for in Q2 2023.
For further understanding of GlobalData's Packaging: Patents Trends Q3 2023, buy the databook here.