Avery Dennison‘s patent involves a method for transferring RFID inlays between substrates using adhesives. The process includes securing the inlay to a first substrate, transferring it to a second substrate with a different adhesive, and then dissociating it from the first substrate. Additional steps involve securing a third substrate to the inlay. GlobalData’s report on Avery Dennison gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on Avery Dennison, Pressure Sensitive Adhesive Tape was a key innovation area identified from patents. Avery Dennison's grant share as of May 2024 was 55%. Grant share is based on the ratio of number of grants to total number of patents.
Transferring rfid inlay between substrates using adhesives
A recently granted patent (Publication Number: US11995493B2) discloses a method for transferring an RFID inlay efficiently. The method involves securing the RFID inlay to a first substrate using a first adhesive, then bringing it into the vicinity of a second substrate with a second adhesive and a liner. The RFID inlay is then secured to the second substrate with the second adhesive, dissociated from the first substrate, and finally secured to a third substrate using an adhesive, positioning the RFID inlay between the second and third substrates.
Furthermore, the patent details various aspects of the method, including the process of dissociating the RFID inlay from the first substrate, which can involve softening the first adhesive with heat or a softening substance. The method also describes the use of different release strengths for the first and second adhesives to facilitate the dissociation process. Additionally, the patent outlines the use of reels for unwinding and winding the substrates, as well as the application of the second adhesive to the second substrate after unwinding. Overall, the method provides a systematic approach to transferring RFID inlays between substrates, ensuring efficient and reliable positioning of the inlays for various applications.
To know more about GlobalData’s detailed insights on Avery Dennison, buy the report here.
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