DS Smith has filed a patent for a method to customize cardboard sheets for packaging. The process involves creating wave-shaped crease lines and applying glue for folding into a package. This innovation aims to enhance packaging efficiency and protection during shipping. GlobalData’s report on DS Smith gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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According to GlobalData’s company profile on DS Smith, Multi-pack shrink wrapping was a key innovation area identified from patents. DS Smith's grant share as of January 2024 was 70%. Grant share is based on the ratio of number of grants to total number of patents.

Customizable packaging method using wave-shaped crease lines

Source: United States Patent and Trademark Office (USPTO). Credit: DS Smith Plc

A patent application (Publication Number: US20230391037A1) describes a method for customizing a blank of cardboard or corrugated cardboard to create a foldable package suitable for shipping items. The method involves creating wave-shaped crease lines on the blank, along with straight crease tracts and applying glue strategically. The distance between the crease lines can be adjusted based on the item to be packaged, and V-shaped crease lines can be added to certain panels. The method also includes using wheels with circumferential projections to create the wave-shaped crease lines, all fixed to a common shaft.

Furthermore, the patent application details the creation of a blank and subsequent package from the customized blank. By folding the panels and wings along the crease lines, a package with flat back and front walls and undulated top, bottom, left, and right side walls is formed. The package can be used to contain items for shipping, with different methods outlined for placing the item within the package before or after forming the walls. Overall, the patent application provides a detailed method for creating customized packaging solutions from cardboard or corrugated cardboard blanks, offering versatility and efficiency in the shipping process.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.