Sonoco Products. has filed a patent for a packaging structure that hermetically encloses a product before opening. The structure includes a removable portion defined by a line of weakness and a flap that is affixed to the packaging structure using both permanent and peelable adhesive. The flap is aligned with the removable and marginal regions of the packaging structure. GlobalData’s report on Sonoco Products gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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According to GlobalData’s company profile on Sonoco Products, Magnetic lids was a key innovation area identified from patents. Sonoco Products's grant share as of September 2023 was 60%. Grant share is based on the ratio of number of grants to total number of patents.

A hermetically sealed package with a removable portion and flap

Source: United States Patent and Trademark Office (USPTO). Credit: Sonoco Products Co

A recently filed patent (Publication Number: US20230312210A1) describes a new packaging structure for products that provides both hermetic enclosure and easy opening and reclosing capabilities. The package includes a line of weakness that defines a removable portion and a marginal region, along with an adhesive layer that contains both permanent adhesive and peelable adhesive. A flap is affixed to the packaging structure using the adhesive layer, with the central region of the flap aligned with the removable portion and affixed using the permanent adhesive, while the peripheral region is aligned with the marginal region and affixed using the peelable adhesive.

The peelable adhesive can be a resealable adhesive or a pressure-sensitive adhesive. The line of weakness extends into the packaging structure, but not through it, and may also extend into the adhesive layer or a sealant layer if present. The line of weakness can be formed through electron-beam treatment or by creating a stressed or damaged portion of the packaging structure. It can also define a closed shape.

When the package is opened, the peripheral region of the flap releases from the marginal region of the packaging structure, while the removable portion remains affixed to the central region of the flap as it is lifted out of the plane of the packaging structure. In the reclosed configuration, the peripheral region of the flap readheres to the marginal region of the packaging structure.

The patent also describes alternative embodiments of the packaging structure, including variations in the adhesive layer. For example, the adhesive layer can contain patterned permanent adhesive and patterned resealable adhesive, or patterned permanent adhesive and pressure-sensitive adhesive. The line of weakness remains rupturable in these embodiments, and the opening and reclosing mechanisms function similarly to the first embodiment.

Overall, this patent presents a packaging structure that combines hermetic enclosure with easy opening and reclosing capabilities, providing convenience and freshness for consumers. The various embodiments offer flexibility in adhesive options while maintaining the integrity of the package.

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GlobalData, the leading provider of industry intelligence, provided the underlying data, research, and analysis used to produce this article.

GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.