Tomra to buy New Zealand’s BBC Technologies for $48.6m
Based in Hamilton, BBC Technologies designs, develops and produces turnkey lines with traceability and analytics software features.
BBC provides a variety of solutions to packhouses worldwide, which range from bespoke packing lines to off-the-shelf processing equipment.
The company also offers the freshtracker system, which helps track origins and characteristics of individual products from harvesting, processing and packaging to point-of-sale.
Dalehead Foods designs new paperboard packaging for fresh meat market
UK-based meat products supplier Tulip’s affiliate Dalehead Foods has launched a new paperboard packaging for the fresh protein market.
Inspired by the card packs used in the sandwich market, the new packaging is now available on three ready-to-eat turkey meats in Waitrose stores across the country.
In an effort to differentiate from other products, the company has designed the packs with full printing on all sides.
The products containing the packaging include Rosemary, Lemon & Garlic Free Range Turkey Breast, Honey and Mustard Free-Range Turkey Breast, and Butter-Roasted Free Range Turkey Breast.
Clondalkin introduces PCR shrink sleeve
UK-based shrink sleeve manufacturer Clondalkin Flexible Packaging Bury (formerly Chadwicks ) has launched a shrink sleeve material containing post-consumer recycled content (PCR).
The PCR does not affect the quality of the finished product, so the film clarity, print quality and shrinkage properties are the same as those found in standard polyethylene terephthalate (PET) shrink sleeve film material.
The new shrink sleeve technology has been developed by Clondalkin in collaboration with a major UK-based thermoplastic distributor. PCR helps reduce landfill waste, greenhouse gases and energy consumption.
Weener Plastics completes acquisition of Russia’s Artpack
Dutch packaging supplier Weener Plastics (WP) Group has completed the acquisition of Russia-based bottle manufacturer Artpack for an undisclosed amount.
The acquisition is expected to be part of WP’s global expansion strategy.
Founded in 2003, Artpack is located in Dzerzhinsk, Nizhny Novgorod, approximately 400km east from Moscow.
In addition to producing plastic bottles for the personal and home care industries, Artpack is reported to have significant technological capabilities and a highly qualified staff.
Starbucks UK launches paper cup charge trial in London
US coffee chain Starbucks has started a 5p paper cup charge trial in London that aims to test and influence consumer behaviour towards the need to cut waste.
For a period of three months starting from 26 February, the company will impose a 5p charge on all the plastic-lined paper cups purchased in 35 of its stores across the city, West End and west London, to see whether customers will start carrying reusable cups.
Starbucks will donate the proceeds from the charge to environmental charity and behaviour change analysts Hubbub , who will keep track of consumer reactions, contributing to the reduction of waste in the capital.
The move comes after research carried by Starbucks revealed that almost half of the consumers surveyed claimed they would carry a reusable cup as a consequence of the 5p charge.
Scientex to buy film solutions provider KHPI
Malaysian packaging manufacturer Scientex Berhad’s wholly owned subsidiary Scientex Packaging Film Sdn Bhd” target=”_blank”>Scientex Packaging Film has signed a sales and purchase agreement to fully acquire Klang Hock Plastic Industries (KHPI) for MYR190m ($48.5m).
With the acquisition, Scientex Berhad is set to become a regional hub in the flexible plastic packaging (FPP) market.
Founded in 1976, KHPI manufactures custom films such as shrink films, polyethylene (PE) films, tubes and bags, lamination films, stretch films, stretch hoods, agriculture films and flexitank films.
Hub Labels adds MPS EF multi-substrate flexo press for linerless labels
US-based manufacturer Hub Labels has acquired a new press from MPS to produce linerless labels.
The automated MPS EF is a multi-substrate flexographic press, designed for both high-quality label production and flexible packaging printing.
The EF will also enable Hub Labels to print a range of substrates, including thin film, paper, shrink sleeves and flexible packaging.
Yili Weikezi milk drink uses augmented reality packaging
Chinese dairy company Yili Weikezi has started using augmented reality (AR) on the packaging of its milk cartons.
A voiceprint of Lu Han, a popular singer in China, is printed on each milk package. Scanning the voiceprint with a specific smartphone app plays an audio greeting, with each flavour—coffee, strawberry, banana and chocolate—having a unique message.
The app also features floating planets that consumers can play with and customise: they can tap the planets for sound, record their own voiceprints, create their own planets using AR and voiceprint technology, and share the results with their friends.
HP expands labels and packaging portfolio with new technologies
HP has expanded its labels and packaging portfolio by introducing two new technologies, the Indigo 6900 Digital Press and the PageWide C500 Press.
Designed for the label and packaging market, the HP Indigo 6900 Digital Press is integrated with Pack Ready for Labels, the Production Pro, Indigo GEM embellishment unit, Indigo ElectroInk Silver and Indigo ElectroInk Invisible Blue and Yellow.
It is said to increase digital production profit by offering higher revenue per metre.
Air Products to unveil fluxless soldering technology for wafer level packaging
US-based industrial gases company Air Products is set to launch a fluxless soldering technology that uses electron attachment (EA) technology for wafer level packaging applications.
The proposed launch is expected to take place at the IPC APEX Expo in San Diego, California, US, later this month.
Using activated hydrogen at ambient pressure, the EA technology removes metal oxides from electroplated solder bumps on semiconductor wafers.
The technology also helps to obtain the relevant shape and size for interconnection onto a package or substrate by allowing reflow of the bumps, as well as offers an enhanced bump reflow quality as a result of flux induced solder voids and wafer contaminations, which naturally get eliminated.
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