Cadence Design Systems will collaborate with US-based Amkor Technology to develop a package assembly design kit (PADK) for its SLIM and SWIFT advanced fan-out technologies.
Under the deal, Cadence will provide development support based on its Physical Verification System (PVS) software tool.
This integrated solution helps Amkor’s customers meet requirements needed for complete package-level sign-off verification and provides more collaboration with their customers.
The companies are expecting to fill the gap between semiconductor die design and package design, while refining its methods for the SLIM and SWIFT technology.
Amkor Technology’s research and development corporate vice-president Ron Huemoeller said: "We’re at a critical juncture in the semiconductor industry with increased dependence on packaging solutions for delivery of next-generation products.
"The development of these PADKs, the latest outcome of our lengthy collaboration with Cadence, addresses a critical gap forming between foundry and back-end-of-line, as fan-out packaging solutions blur the lines between these processes.
"Based on our vast experience with advanced package design methodologies, Amkor is well positioned to lead the industry with our unique fan-out packaging technologies."
Established in 1968, the company is now a strategic manufacturing partner for over 250 semiconductor companies, foundries and electronics OEMs.
Amkor currently has production facilities, development centres, and sales and support offices in major electronics manufacturing regions in Asia, Europe, and the US.