Curtiss-Wright divests engineered packaging business in US

5 July 2015 (Last Updated July 5th, 2015 18:30)

US-based establishment Curtiss-Wright Corporation has divested its engineered packaging business, formerly Hybricon, to Atrenne Integrated Solutions.

electronic packaging

US-based establishment Curtiss-Wright Corporation has divested its engineered packaging business, formerly Hybricon, to Atrenne Integrated Solutions.

The sale is in line with the company's long-term strategy to improve operating margins, increase cash flow and position Curtiss-Wright for sustained growth.

Curtiss-Wright's engineered packaging business develops electronic packaging solutions that are specifically tailored to operate in a variety of demanding real-world environments for military and aerospace customers.

Its solutions include features such as extreme cooling of high-powered electronics, enhanced signal integrity properties, small-dimensional footprint and weight, and intense ruggedness, including the ability to withstand heat, shock, vibration, acceleration, humidity, sand, dust, salt and other influences.

"The divestiture of this non-core operation further enables Curtiss-Wright to become a top-quartile performer in our peer group."

Commenting on the deal, Curtiss-Wright chairman and CEO David C Adams said: "Furthermore, it enables us to focus on our core businesses, while also providing a better strategic fit for their product portfolio.

"The divestiture of this non-core operation further enables Curtiss-Wright to become a top-quartile performer in our peer group."

The financial terms of the transaction have not been disclosed.

The deal will enable Atrenne to boost growth in rugged, custom and commercial, off-the-shelf chassis and backplanes for defence, commercial and industrial markets.

This will combine Hybricon's high-speed signaling technology and portfolio of field-proven enclosure designs with Atrenne's electronic assemblies, front panels, extruded aluminium enclosures, card cages, integrally lit control panels, simulator components/assemblies, connectors, interconnects, speciality CCAs and backplanes.


Image: Curtiss-Wright's engineered packaging business develops electronic packaging solutions. Photo: courtesy of koko-tewan via freedigitalphotos.net.