American semiconductor company Onto Innovation has launched a new ‘Applications Center of Excellence’ dedicated specially for panel-level packaging (PLP) to facilitate growth in the chiplet market.

This centre is located within the company’s headquarters in Wilmington, Delaware, US.

It will function as a combined tool demonstrator, process integration photo resist qualification, as well as a research and development (R&D) centre.

Onto said the facility has been developed primarily for supporting advanced packaging process development for PLP, advanced integrated circuit substrates, and wafer-level packaging.

In addition, the facility will provide hands-on experience of Onto’s hardware and software solutions such as the Firefly sub-micron panel defect inspection system, large exposure field JetStep X500 lithography system and Discover software family, to the company’s PLP customers.

The centre will also allow customers to access the systems and processes that are offered by collaborating with OEMs and materials providers.

How well do you really know your competitors?

Access the most comprehensive Company Profiles on the market, powered by GlobalData. Save hours of research. Gain competitive edge.

Company Profile – free sample

Thank you!

Your download email will arrive shortly

Not ready to buy yet? Download a free sample

We are confident about the unique quality of our Company Profiles. However, we want you to make the most beneficial decision for your business, so we offer a free sample that you can download by submitting the below form

By GlobalData
Visit our Privacy Policy for more information about our services, how we may use, process and share your personal data, including information of your rights in respect of your personal data and how you can unsubscribe from future marketing communications. Our services are intended for corporate subscribers and you warrant that the email address submitted is your corporate email address.

Onto CEO Michael Plisinski said: “Our customers want to accelerate their technology roadmaps, and we will assist them by leveraging our experience and access to next-generation processes and equipment, from both Onto and our partners.

“This collaborative approach to process development will help our customers accelerate roadmaps and we expect this will result in shortened time to yield when in production.”

The centre is expected to further strengthen Onto’s capabilities to capitalise on the technical complexities and fast growth of the chiplet market.

Plisinski added: “The R&D phase is more important now than ever, especially when it concerns PLP.

“By facilitating connections between Onto, our customers and our collaborators, we will use this critical time to craft turnkey solutions for build-up films, redistribution layers, photoresists, copper-clad laminate substrates and glass substrates.

“With the application of Onto’s smart factory-enabling Yield Optimiser software, we can intelligently bridge the gaps between fabrication and advanced packaging processes, accelerating time to market for key process steps that bring heterogeneously integrated chips, and chiplets to life.”