Samsung introduces LED modules for chip-scale packaging

12 October 2016 (Last Updated October 12th, 2016 18:30)

Samsung Electronics, a global manufacturer of advanced component solutions, has introduced a new line-up of chip-scale package (CSP) LED modules for spotlights and downlights.

Samsung Electronics, a global manufacturer of advanced component solutions, has introduced a new line-up of chip-scale package (CSP) LED modules for spotlights and downlights.

Samsung is the first company to incorporate CSP-based LED modules offering a wide range of lighting benefits, such as colour tunability, increased design compatibility and a significant reduction in the size of LED packages.

The CSP LED modules features a combination of advanced flip chip and phosphor coating technology, which removes metal wires and the plastic mould to provide a compact design during manufacturing LED modules and fixtures.

Samsung Electronics LED Business Team executive vice-president Jacob Tarn said: “Our new CSP LED modules provide an optimal solution for lighting manufacturers who seek highly compatible and reliable LED components.

"Samsung will continue to strengthen its CSP technology leadership and spearhead new innovations in LED component technology."

“Samsung will continue to strengthen its CSP technology leadership and spearhead new innovations in LED component technology to bring greater value to our customers.”

The colour-tunable LED module requires twice the number of LED packages in cold and warm temperatures.

Samsung's compact chip-scale LED packages are available in two versions, namely 19x19mm or 28x28mm, and designed according to Zhaga specifications, making them highly convenient in assembling.

The modules also offer beam angle options such as spot, medium, wide, and will be compatible with the optical solutions of Samsung’s partners.


Image: Samsung introduces LED modules for chip-scale packaging. Photo: courtesy of Samsung.