International technology group Schott has announced its plans to strengthen its existing glass substrate portfolio to better support advanced semiconductor chip packaging requirements in the future.
SCHOTT, whose founder Otto Schott is claimed to be a speciality glass inventor, said it is working to support the integrated circuit (IC) industry by advancing the ‘pace of Moore’s law’ with new materials.
The company said that this sort of development is required for applications such as AI.
According to SCHOTT, high-quality glass substrates play a key role in the future of chip packaging.
To address the IC industry’s increasing need for glass substrates, SCHOTT is implementing a three-point action plan.
SCHOTT CEO Frank Heinricht said: “Today, we are announcing a three-point action plan to tackle the increasing demand for glass substrates for advanced packaging.
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“Our action plan is broken up into three points of focus: researching, upgrading, and investing.
“As we have been in a constant exchange with industry leaders, we are now accelerating our product development and have already established a leading position to immediately supply high-quality substrates the chip industry’s R&D [research and development] teams need.”
More specifically, these three aforementioned points include product innovations, upgrading existing substrates, and an expansion of the company’s melting and processing facilities.
One key focus is to upgrade existing glass substrates by improving their geometric tolerances, achieving exceptional flatness, and adding maximum versatility to the format.
SCHOTT will also expand its capacities and capabilities at its facilities in Europe and Asia.