Finnish pulp and paper manufacturer Stora Enso has partnered with NXP Semiconductors to develop traceable smart packages by integrating radio frequency identification (RFID).

The new packages will include NXP’s near field communication (NFC) and ultra-high frequency (UHF), allowing businesses to track their products throughout the supply chain.

The companies will also develop tamper evidence applications in order to detect if a package is damaged before reaching the consumer.

These intelligent packaging solutions will verify the authenticity of the product, as well as provide care, usage and other important information via the NFC-enabled tag.

"Our RFID technology in combination with Stora Enso’s packaging solutions creates additional value to both consumers and brand owners."

NXP Semiconductors security and connectivity executive vice-president and general manager Ruediger Stroh said: "Our RFID technology in combination with Stora Enso’s packaging solutions creates additional value to both consumers and brand owners by providing information and insights along the complete supply chain.

"The ability of the RFID tag to detect when a package has been compromised and also provide additional product information via NFC truly enables a unique, smart, engaging brand experience and is another example of how security can be broadly implemented to protect our everyday lives."

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Stora Enso has undertaken the new initiative as part of its strategy to develop its packaging business.

In sync with its strategy, the company commissioned its micro-fibrillated cellulose (MFC) production plant at Imatra, Finland, earlier this year.

The MFC plant provides raw material for the production of lightweight packaging.

Stora Enso’s packaging businesses is also opening an Innovation Centre in Helsinki later this year to focus on idea generation, design, new business development and incubation.

Image: Stora Enso will develop smart packages with NXP technologies. Photo: courtesy of NXP Semiconductors.