Dow has announced the 2023/2024 edition of its Packaging Innovation Awards (PIA).
The awards recognise breakthroughs in technological advancement, sustainability, and enhanced user experience within the global packaging industry.
As one of the industry’s longest-running independently judged awards, the global program – now into its 35th edition – will be held in Asia-Pacific this year as the region plays host for the first time to both the judging event and awards ceremony.
This edition marks the beginning of a new biennial format that provides a longer submission period to give participants more time to collaborate with relevant partners on building out a submission.
The goal is to provide an accessible platform for a greater pool of packaging professionals to have their most innovative designs judged on the world’s stage, further accelerating innovation in packaging.
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PIA Jury Chairperson David Luttenberger commented: “Given Asia-Pacific’s well-established role as the manufacturing hub of the world, there is no better time or place to underscore the importance of packaging innovation.”
The submission period is now open and closes on March 8 2024. Award finalists will be notified on August 28, 2024, with the awards ceremony set to take place in Tokyo, Japan in October 2024.
Entries for the 2023/2024 Packaging Innovation Awards can be submitted here. Entry in the competition is free, and applicants are not required to use Dow materials in their products. All entries must be commercial products that have been on the market for more than six months by the last day entries are open to submission.