BERHALTER Swiss Die-Cutting at LABELEXPO AMERICAS
When: 13–15 September 2022
Where: Donald E Stephens Convention Center, Chicago, Illinois, US
IIoT is coming to the print and packaging industry. Berhalter will present the new Swiss Die-Cutter™ B6, delivering 500 strokes per minute.
Digital die-cutting drive and maximum precision. Individually controlled die-cutting motion, flexibly adjustable opening level of the punching tool, digitally monitored penetration depth and a new active foil guide built into the punching tool.
Another highlight will be the new CUTcontrol™ technology, which is a revolutionary IIoT platform. This technology can link all production processes and provide the KPIs for strategic production planning, including live data streams from machines, accessories and punching tools.
Whether you want to die-cut flat packaging lids, deep-drawn lids, paper labels or IML labels for medium to high volumes, with the Swiss Die-Cutter B6, you meet all requirements and increase your profit margin. First-class quality at the lowest production costs. Visit us at Booth 5721.