Uflex to Exhibit at PACK EXPO International

India’s largest multinational flexible packaging materials and solution company Uflex is attending the forthcoming PACK EXPO International event.

The US tradeshow takes place on 6-9 November at McCormick Place in Chigago, Illinois, US. The event will host more than 45,000 from around 40 vertical markets.

Uflex will be at Booth N-4749.

Approximately 7,000 international purchasers are expected to be in attendance from more than 130 countries.

More than 2,100+ companies will be exhibiting over the three days, covering around 1.2 million square feet.

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